// pages/main/forum/forumDetail.js
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    forumScheduleList: [{
      date: '12:30-13:00',
      content: [{
        type: 'title',
        title_en: 'Registration',
        title: '来宾登记',
      }]
    },{
      date: '12:30-13:00',
      content: [{
        type: 'guest',
        img: '../../../images/guest_demo_img1.jpg',
        text_bold: 'Opening Ceremony and Remarks\n开幕典礼及致辞\nLung Chu 居龙',
        text: 'President, SEMI China; Vice President, SEMI',
      },{
        type: 'title',
        title_en: 'Welcome Remark',
        title: '政府领导致辞',
      },{
        type: 'guest',
        img: '../../../images/guest_demo_img2.jpg',
        text_bold: 'Ajit Manocha',
        text: 'President & CEO, SEMI\nSEMI 总裁兼首席执行官',
      },{
        type: 'guest',
        img: '../../../images/guest_demo_img3.jpg',
        text_bold: 'Ning Wang 王宁',
        text: 'President, CECC\n中国电子商会会长',
      },{
        type: 'guest',
        img: '../../../images/guest_demo_img4.jpg',
        text_bold: 'Mary G. Puma',
        text: 'Chairman, SEMI International Board; Executive Chairperson, Axcelis Technologies, Inc.\nSEMI董事会主席、Axcelis Technologies 执行主席',
      },{
        type: 'guest',
        img: '../../../images/guest_demo_img4.jpg',
        text_bold: 'Mary G. Puma',
        text: 'Chairman, SEMI International Board; Executive Chairperson, Axcelis Technologies, Inc.\nSEMI董事会主席、Axcelis Technologies 执行主席',
      },{
        type: 'guest',
        img: '../../../images/guest_demo_img5.jpg',
        text_bold: 'Moderator 主持人\nThea Shen 沈曦',
        text: 'Deputy Secretary General, SHPEA\n上海市国际股权投资基金协会副秘书长',
      },{
        type: 'title',
        title_en: 'Special Speech',
        title: '特别演讲',
      }]
    },{
      date: '13:50-14:10',
      content: [{
        type: 'guest',
        img: '../../../images/guest_demo_img5.jpg',
        text_bold: 'The Vision of the Fourth Industrial Revolution and Strategy in Smart City Development\n第四次工业革命愿景及智慧城市发展战略\nJeong-kee Kim',
        text: 'Secretary-General, the World Smart Sustainable Cities Organization (WeGO)\n世界智慧可持续城市组织 (WeGO)秘书长',
      },{
        type: 'title',
        title_en: 'Keynote Session',
        title: '主题演讲',
      }]
    },{
      date: '14:10-14:35',
      content: [{
        type: 'guest',
        img: '../../../images/guest_demo_img5.jpg',
        text_bold: 'Semiconductor Process Technology: History and Consideration\n半导体工艺技术的发展和思考\nPeng Bai 白鹏',
        text: 'Executive Director and President, Hua Hong Semiconductor Limited\n华虹半导体有限公司执行董事及总裁',
      }]
    },{
      date: '14:35-15:00',
      content: [{
        type: 'guest',
        img: '../../../images/guest_demo_img5.jpg',
        text_bold: 'Manufacturability and Reliability of Heterogeneous and Heterostructured Integration of Chips\n芯片异质异构集成可制造性与可靠性\nSheng Liu 刘胜',
        text: 'Academician, Chinese Academy of Sciences; Executive Dean of the Industrial Science Research Institute; Dean of the School of Power and Machinery at Wuhan University\n中国科学院院士、武汉大学工业科学研究院执行院长、动力与机械学院院长',
      }]
    },{
      date: '15:00-15:25',
      content: [{
        type: 'guest',
        img: '../../../images/guest_demo_img5.jpg',
        text_bold: 'Manufacturability and Reliability of Heterogeneous and Heterostructured Integration of Chips\n芯片异质异构集成可制造性与可靠性\nSheng Liu 刘胜',
        text: 'Academician, Chinese Academy of Sciences; Executive Dean of the Industrial Science Research Institute; Dean of the School of Power and Machinery at Wuhan University\n中国科学院院士、武汉大学工业科学研究院执行院长、动力与机械学院院长',
      }]
    },{
      date: '15:25-15:50',
      content: [{
        type: 'guest',
        img: '../../../images/guest_demo_img5.jpg',
        text_bold: 'Latest Technology Trends in the Semiconductor Industry\n半导体产业前沿技术发展趋势\nAkihisa Sekiguchi 関口 章久',
        text: 'Fellow, Tokyo Electron Limited\nTEL首席技术官',
      }]
    },{
      date: '15:50-16:15',
      content: [{
        type: 'guest',
        img: '../../../images/guest_demo_img5.jpg',
        text_bold: 'Enabling the AI era\n赋能AI时代\nChoon Khoon Lim 林俊勤',
        text: 'CEO, Advanced Packaging, Semiconductor Solutions, ASMPT\nASMPT半导体解决方案分部先进封装业务部首席执行官',
      }]
    },{
      date: '16:15-16:30',
      content: [{
        type: 'title',
        title_en:'Thank you',
        title: '致谢结束'
      }]
    }]
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